在线询价 全球分支机构
网站地图 在线购买 中 / VN
  • 一般
  • 制品
  • 文学
  • SDS / TDS
+84 028 3926 0681
+86 755 22945833
首页
产品中心
按制造商
按市场
粘合剂
Conformal Coatings
Encapsulants
Labeling Printing and Inks
Dispensing Equipment and Supplies
Lubricant Products
Maintenance Repair Products
Sealants
Static Control Materials and Equipment
Soldering Materials and Equipment
Surface Preparation Materials
Thermally Conductive Materials
Tapes
UV Curing Equipment
Specialty Chemicals
经销品牌
3M
Dow
Armstrong Epoxy
Bostik
Cast-Coat
Henkel Loctite
Cytec
Dymax
Eclectic
Fisnar
Fluid Research
Glue Dots
H.B.Fuller
Humiseal
Kakuhunter
Hardman
ITW Polymers Adhesives
ITW Dynaloy
Kitpackers
LORD Corp
MicroCare
MoldMan Systems
PPG Industries
Resinlab
Resin Designs
Resin Technology
Robnor-Resinlab
Sauereisen
Sulzer
Techcon Systems
Techspray
The Glue Factory
Creative Materials
应用市场
一般工业
交通运输
电子电气
消费产品
LED照明
医疗器械
新能源
优势服务
认证和文档控制
定制配方
定制标签
定制包装
低压注塑工艺
保护性外包装
保质期和批量控制
资源库
Videos
GHS
产品目录
文献库
行业动态
Podcasts
Contact Us
联系我们
全球分布

    产品类别

    应用市场

首页>资源库>行业动态

Bostik Born2Bond™ UV Cure-In-Place Gasket (UV-CIPG)

　
Bostik, an Arkema company, is a leading global adhesive specialist in construction, consumer and industrial markets. The Born2Bond™ UV-CIPG range is Bostik’s latest innovation in engineering adhesives and has been designed to replace traditional gaskets in production processes and to accommodate modern demands.
 
The technology features high efficiency and precision, can be easily dispensed by robots on smart production lines that assemble gadgets and devices that are growing smaller and more complex. The gasket is cured immediately during application using UV light. Available in a range of viscosities, with varying specifications, these CIPGs are suitable for a wide range of applications and assembly processes across multiple industries, including Automotive and Electronics.
 
Watch this video and learn about Bostik's cure-in-place gasket (CIPG) bonding solutions designed to reduce material waste, decrease labor costs, and more.
 

Features of Born2Bond™ UV-CIPG
 
• Extremely flexible and durable - no cracking when compressed or deformed
• Resistant to temperature fluctuations and chemicals
• High thixotropic indexes resulting in a consistent bead aspect ratio
• Waterproof (IPX7) and dustproof
• Immediate curing using UV light
• Suitable for high-precision automated dispensing
 
Typical Applications of Born2Bond™ UV-CIPG
 
• Wearable devices
• Smartphones
• Tablet PCs
• Digital cameras
• Security cameras
• Automotive electronic (e.g. ADAS, ECUs)
• Enclosures
 
 
Ellsworth Adhesives is authorized distributor of Bostik all over the world. Please feel free to contact us if you have any queries.

Link: https://apac.bostikindustrial.com/?Engineering-Adhesives/Cure-In-Place-Gaskets-New-Bonds-To-Sustain-The-Eco.html

 

联系我们

+84 028 3926 0681info@ellsworth.com.vn

Tầng 1, 99 Nguyễn Thị Minh Khai, Phường Bến Thành, Quận 1, TP HCM, Việt Nam


版权所有©2006-2024 安士澳粘合剂