Source:Loctite.com / Editor:Ellsworth Adhesive
Henkel’s TECHNOMELT® low pressure molding materials are a single-material solution that delivers a simple, streamlined and low-cost alternative to multi-step, multi-material PCB protection methods. A three-step process where parts are inserted into the moldset, molded and tested, low pressure molding eliminates messy two-part material mixing routines, device preparation (masking), long cure times and material waste.
CIRCUIT BOARD PROTECTION TECHNOLOGY COMPARISON
Traditional CBP Materials | Material Challenges | TECHNOMELT Low Pressure Molding Solutions |
Potting |
● Two-part systems; mixing required ● Non-reworkable ● Large equipment investment and footprint ● 24 – 72 hours cure schedule ● Up to 8 process steps ● 5 – 7 BOM part numbers in inventory |
● One part; no mixing ● Reworkable ● Weight reduction ● Low waste ● 30 sec. – 2 min. cycle times ● Strain relief ● Green technology; no VOC |
Sealing |
● Limited by housing dimensions; space constraints ● 48 – 72 hours cure schedule ● Up to 6 process steps ●5 – 7 BOM part numbers in inventory |
● No housing; fewer part numbers ● Only 3 process steps ● Improved aesthetic appearance; skylining ● Only 1 BOM part number required ● In-line and high-volume processing |
Conformal Coating |
● Very limited mechanical strength ● 4 – 12 hours cure schedule ● Up to 8 process steps ● 3 – 4 BOM part numbers in inventory |
● No cure ● Temperature, vibration, impact and chemical resistance ● Watertight encapsulation ● Good mechanical strength ● Translucent materials available for optical inspection |
References: https://dm.henkel-dam.com/is/content/henkel/lt-4182-brochure-technomelt-low-pressure-molding-solutions