ResinLab EP965LVLX Epoxy Encapsulant Part B Black 5 gal Pail
型号:EP965LVLX BLACK - B PL
制造商SKU:EP965LVLX BLACK B PL
ResinLab EP965LVLX Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium casting, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.