ResinLab EP965 Epoxy Encapsulant Part B Clear 1 gal Pail
型号:EP965 CLEAR - B GL
制造商SKU:EP965 CLEAR B GL
ResinLab EP965 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 1 gal Pail.