ResinLab EP691F Epoxy Encapsulant Part B Clear 5 gal Pail
型号:EP691F CLEAR - B PL
制造商SKU:EP691F CLEAR B PL
ResinLab EP691F Clear is a two component, room temperature or heat curing, epoxy encapsulant that is used for medium to large castings and filling voids. It is electronic grade, rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.